BGA IC Reballing

Reballing BGA IC (Method)

Here is the step by step process to do so.
  • 1. Remove the BGA ic by hot air machine/workstation.
  • 2. Then clean the ic by removing it's balls by iron.
  • 3. Now clean the PCB from where ic is removed and remove extra solder.
  • 4. Now set the ic in below the stencils in BGA Kit according to the ic.
  • 5. Now apply some PPD paste on the stencils where ic is set.
  • 6. Now apply some heat by hot air machine, where PPD paste is applied.
  • 7. Now IC reball is done, now you can resold this IC to the PCB

Comments

Popular posts from this blog

Mobile repairing tools

Disk management system