Reballing BGA IC (Method)

Here is the step by step process to do so.
- 1. Remove the BGA ic by hot air machine/workstation.
- 2. Then clean the ic by removing it's balls by iron.
- 3. Now clean the PCB from where ic is removed and remove extra solder.
- 4. Now set the ic in below the stencils in BGA Kit according to the ic.
- 5. Now apply some PPD paste on the stencils where ic is set.
- 6. Now apply some heat by hot air machine, where PPD paste is applied.
- 7. Now IC reball is done, now you can resold this IC to the PCB
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